New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on power, performance, and cost. Power architect Barry Pangrle explains why the ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

PCIe 6, released in January 2022, introduced a data transfer rate of 64 GT/s (gigatransfers per second), double that of its ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Space is a harsh environment. There’s no breathable air, radiation levels are 15 times higher than on Earth, and the approximate temperature is 2.7 Kelvin (minus 270.45 degrees Celsius or minus 454.81 ...