Chiplets for physical AI; rack-level considerations; verification complexity; sparse matrix workloads; AI data centers.

Who verifies the verifier? This is the age-old question for anyone involved in the verification of semiconductor systems. Who ...

Shift left is pushing beyond verification to system-level validation. Fragmented workflows with disconnected tools and models are allowing bugs to escape even though individual components have been ...

HBM shortages threaten AI expansion; TSMC weighs price hikes; advanced packaging ramps; domain-specialized AI models; ...

Technology is only useful if it improves an existing methodology. Property generation is still refining that goal, but in the ...

This is the third article in a series examining what it takes to build production-ready AI agents for EDA. The first explored the architectural decisions required for agents to operate reliably in ...

Solving difficult bugs while intelligently deciding what to investigate, what to rerun, and where to spend compute.

Physics-based analysis becomes more consequential as chips, packages, boards, and systems are designed together.

Advanced packaging requires models to cross company boundaries without exposing proprietary processes, but hiding too much ...

STCO for heterogeneous design; physical AI interactions; signing off AI-generated designs; workload profile analysis.