Global smartphone SoC shipments declined by 21% YoY in 3Q 2026 amid rising memory costs, longer replacement cycles and ...
The demonstrations will cover 1.6T interconnect validation, AI-assisted design, RF testing, cybersecurity and EV charging.
Physical AI deployment depends on balancing computing performance, energy efficiency, system integration, safety and ...
WICOP 3 technology produces white light without rare earths or packaging, targeting lighting, AR displays and optical ...
The 16-bit RL78/G21 targets appliance control with lower power consumption, while RL78/G23 adds capacitive-touch channels for ...
Four device families target applications from AI infrastructure and high-speed networking to robotics, industrial automation ...
Optical-grade SiC substrates target AR waveguides and quantum applications, with development progressing toward larger wafers ...
The acquisition combines optical and electrical interconnect technologies, laser manufacturing and advanced semiconductor ...
AMD's David Wang sees talent development, open standards and industry collaboration as critical to Taiwan's AI ambitions.
Introduction Join us for a webinar where we dive into how MEMS switches are transforming high-speed loopback testing in AI ...
Cadence will provide AI-enabled design, simulation and engineering expertise to DOE laboratories working on advanced ...
Siemens expands agentic AI workflow for faster signoff-grade electrothermal analysis across complex 3D IC package designs.
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