Chiplets for physical AI; rack-level considerations; verification complexity; sparse matrix workloads; AI data centers.

Who verifies the verifier? This is the age-old question for anyone involved in the verification of semiconductor systems. Who ...

Technology is only useful if it improves an existing methodology. Property generation is still refining that goal, but in the ...

Physics-based analysis becomes more consequential as chips, packages, boards, and systems are designed together.

Because foundries are oversubscribed, OSATs are also fully utilized, which favors ROI. “The sector is constrained by ...

Researchers at Chinese Academy of Sciences, Jilin University, State Key Laboratory of Advanced Manufacturing for Optical ...

Rise in complexity is pushing engineers to validate hardware, software, and physical constraints earlier in the design flow, but fragmented workflows make that difficult.

Two devices operating at exactly the same voltage, frequency, and temperature can behave differently depending on what they ...

Advanced packaging requires models to cross company boundaries without exposing proprietary processes, but hiding too much ...

For FA, engineers need to identify boundaries and be able to decouple individual components to identify the root cause of problems. Underperforming lasers are a substantial issue, making the “golden ...

STCO for heterogeneous design; physical AI interactions; signing off AI-generated designs; workload profile analysis.

AI agents and digital twins are making it possible to explore more design options earlier, including choices involving materials, transistor structures, and chip architectures. Moving work earlier ...