Normal Computing has announced its successful tape-out of the world's first thermodynamic computing chip, called CN101. Designed for AI/HPC data centers, the ASIC is a step away from traditional ...
In a new report from ZDnet, we're learning that SK hynix is nearing the final stage of commercializing its next-generation HBM4 memory, with the design drawings to be transferred to the manufacturing ...
TL;DR: Intel's 18A process node, set for tape-out in 1H 2025, aims to compete with TSMC, marking a significant comeback for Intel in the semiconductor industry. Featuring BSPDN, RibbonFET GAA ...
LAS VEGAS--(BUSINESS WIRE)--Tachyum ® today announced the final build of its Prodigy ® FPGA emulation system in advance of chip production and general availability next year. As part of the ...
China-based electric vehicle (EV) vendor Li Auto reportedly will complete the tape-out of its smart driving SoC by the end of 2024, catching up with its two major domestic rivals, XPeng and NIO, in ...
At Xiaomi's 2025 annual conference, founder Lei Jun spoke with calm restraint about the company's self-developed Xring O1 chip. Yet beneath that composure were moments of risk and suspense: the US$20 ...
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