EDN

Chiplets diary: JEDEC’s tie-up with OCP bears first fruit

While the Universal Chiplet Interconnect Express (UCIe) standard for die-to-die interconnect is getting a lot of attention, significant work is also being carried out on another design front: ...
HotHardware

AMD And JEDEC Are Collaborating On DDR5 MRDIMMs At A Blistering 17,600 MT/s

Memory bandwidth isn't that big of a deal on desktop platforms. Client tasks like office work, web browsing, and even computer games are usually much more sensitive to memory latency than memory ...
Business Wire

JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation

ARLINGTON, Va.--(BUSINESS WIRE)--In an extraordinary leap forward for the chiplet industry, the groundbreaking collaboration between the Open Compute Project Foundation (OCP) and JEDEC is set to usher ...
Design-Reuse

JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen Technologies

ARLINGTON, Va., USA – APRIL 17, 2024 – JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced publication of the JESD79 ...
ExtremeTech

JEDEC Says Dell's CAMM Laptop Memory Tech Will Replace SO-DIMM

Back in April last year, Dell introduced an all-new type of memory module for some of its mobile workstations. It was dubbed CAMM, which stands for Compression Attached Memory Module. We publicly ...