A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation ...

Most of us use our cell phones, smart watches and other electronic devices without giving much thought to the components and how they fit and work together. But it’s a complex problem that ...

Dublin, Nov. 12, 2025 (GLOBE NEWSWIRE) -- The "The Global Market for Polymeric Materials for Advanced Electronic Packaging 2026-2036" report has been added to ResearchAndMarkets.com's offering. The ...

Electronic packaging encapsulates intricate systems whose reliability is critically affected by moisture diffusion and the resultant delamination at material interfaces. As water molecules permeate ...

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...

In a recent article published in Molecules, researchers evaluated the synergistic effect of Aluminum Nitride (AlN) and Carbon Nanotubes (CNTs) on the properties of Silicon Rubber (SR) composites. The ...

Where ceramic packaging and substrates are employed. Why designing solutions with ceramic packaging and substrates is challenging. Ceramic packaging and substrates address high-performance and ...

A technical paper titled “Substrate Embedded Power Electronics Packaging for Silicon Carbide MOSFETs” was published by researchers at University of Cambridge, University of Warwick, Chongqing ...

As microelectromechanical-systems (MEMS) ICs satisfy more functions and proliferate, packaging them into high-density form factors like 3D becomes more of a challenge than conventional ICs. To ...

As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor ecosystem.

(MENAFN- GlobeNewsWire - Nasdaq) Driven by limitations in transistor scaling and demand for high-performance electronics, the market benefits from trends in HPC, AI, automotive systems, and 5G/6G.